品牌:导电胶
起订:1平方米
供应:10000平方米
产品品牌:导电胶
产品型号:SONY
好创好 SONY各向异性导电胶 功能.
是专门为倒装芯片和邦定结合开发的产品。这种各向异性导电胶在老化后拥有良好的可靠性和特性,粘度变化比较小。因此,它非常稳定。
材料介绍:主要成分环氧树脂,镍颗粒导电颗粒
封装条件:
适宜绑定时间:5 -10sec;
温度:190 -230 ℃;
压力:0.2 -1N/撞击
包装形式:10g/支
【Feature】
BP303is a product developed for the flip chip and FOB bonding. This ACP has high connection reliability and good characteristicafter aging. The viscosity change is small. Therefore, it is possible to dispense stably.
【Material description】
Main components:Epoxy resinand Conductive particles of nickel particles
【Package conditions】
Suitable for binding time: 5-10sec;
Temperature: 190 -230 ℃
Pressure: 0.2-1N / bump
Packaging: 10g / each